Bis(phenylsulfonyl)amine, Dibenzenesulfimide
dibenzenesulfonimide
CAS: 2618-96-4
Molecular Formula: C12H11NO4S2
Bis(phenylsulfonyl)amine, Dibenzenesulfimide - Names and Identifiers
| Name | dibenzenesulfonimide |
| Synonyms | BBI BBSI Dibenzolsulfimid Dibenzolsulfimide DIBENZENESULFIMIDE DIPHENYLSULFONIMIDE Dibenzenesulfonamide dibenzenesulfonimide BisBenzeneSulphonamide BIS-BENZENE SULFONIMIDE BIS(PHENYLSULFONYL)AMINE Benzenesulfonic acid imide BIS-(BENZENESULFONYL)IMIDE Bis(benzene sulphonyl)-imide 1,1'-Iminobis(sulfonyl)bis(benzene) N-(Phenylsulfonyl)benzenesulfonamide n-(phenylsulfonyl)-benzenesulfonamid N-(phenylsulfonyl)-Benzenesulfonamide N-phenyl sulfonyl benzene sulfonamida n-(phenylsulphonyl)benzenesulphonamide Benzenesulfonamide, N-(phenylsulfonyl)- Bis(phenylsulfonyl)amine, Dibenzenesulfimide |
| CAS | 2618-96-4 |
| EINECS | 220-051-4 |
| InChI | InChI=1/C12H11NO4S2/c14-18(15,11-7-3-1-4-8-11)13-19(16,17)12-9-5-2-6-10-12/h1-10,13H |
| InChIKey | OVQABVAKPIYHIG-UHFFFAOYSA-N |
Bis(phenylsulfonyl)amine, Dibenzenesulfimide - Physico-chemical Properties
| Molecular Formula | C12H11NO4S2 |
| Molar Mass | 297.35 |
| Density | 1.418±0.06 g/cm3(Predicted) |
| Melting Point | 150-155°C |
| Boling Point | 480.6±28.0 °C(Predicted) |
| Water Solubility | 4.58g/L at 25℃ |
| Solubility | Soluble in water |
| Vapor Presure | 0Pa at 25℃ |
| Appearance | powder to crystal |
| Color | White to Almost white |
| pKa | -1.10±0.40(Predicted) |
| Storage Condition | Sealed in dry,Room Temperature |
| MDL | MFCD00025019 |
| Use | Electroplating additive intermediate, used for the preparation of nickel plating brightener, has good soft and bright effect |
Bis(phenylsulfonyl)amine, Dibenzenesulfimide - Risk and Safety
| Safety Description | S22 - Do not breathe dust. S24/25 - Avoid contact with skin and eyes. |
| WGK Germany | 3 |
| TSCA | Yes |
| HS Code | 29350090 |
Bis(phenylsulfonyl)amine, Dibenzenesulfimide - Upstream Downstream Industry
| Raw Materials | Benzenesulfonyl chloride Benzenesulfonyl chloride |
Bis(phenylsulfonyl)amine, Dibenzenesulfimide - Reference Information
| LogP | 0.52 |
| NIST chemical information | Information provided by: webbook.nist.gov (external link) |
| EPA chemical information | Information provided by: ofmpub.epa.gov (external link) |
| uses | auxiliary brightener and primary brightener for nickel electroplating to improve the ductility of the coating and have the effects of anti-impurity and whitening. as an electroplating additive intermediate, used to prepare nickel plating brightener, has good soft and bright effect; good leveling effect, and consumption is less than saccharin benzene sulfonyl imide compound, it has the general properties of sulfonyl imide, dissolved in lye. In electroplating, it is used as a substitute for the primary brightener-saccharin, has a good leveling effect, and consumes less than saccharin, pharmaceutical intermediates |
| preparation method | in a reaction kettle equipped with electric stirring, thermometer and reflux condenser tube, sodium hydroxide and water are added. after sodium hydroxide is completely dissolved, the temperature is increased to 50-57 ℃, benzenesulfonamide is added, the temperature is controlled at 53-57 ℃, after benzenesulfonamide is completely dissolved, benzenesulfonyl chloride is started to be added dropwise, sodium hydroxide solution is added after dropwise for 30 minutes, maintain the PH value between 8 and 9, keep the temperature for 2 to 4 hours after the benzenesulfonyl chloride is added dropwise, then raise the temperature to 100-105 ℃, reflux for 1 hour, cool the temperature to 26-30 ℃, adjust the PH value to 4.0-7.5 with hydrochloric acid, and separate the solid-liquid mixture with a centrifuge. It uses the addition of alkali to make the sodium salt of BBI directly precipitate from the filtrate, and the good solubility of benzenesulfonamide in the lye will not precipitate with the sodium salt of BBI, so the obtained product has high purity and good solubility. |
| electroplating intermediate | 1. bisphenylsulfonimide is used to formulate a softener for nickel plating, thereby increasing the softness of the coating. 2. auxiliary brightener for nickel plating. 3. Primary brightener, improve the ductility of the coating, has the effect of anti-impurity and whitening, it has the general properties of sulfonimide, dissolved in lye. In electroplating, it is used as a substitute for the primary brightener-saccharin, has a good leveling effect, and consumes less than saccharin. 4. It can also be used to prepare fluorinated reagents. |
Last Update：2024-04-09 20:45:29
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Raw Materials for Bis(phenylsulfonyl)amine, Dibenzenesulfimide